Product Description

Automatic Wafer Cleaning Device After Light Resistance

Product Description

Application field: removal of photoresistance/wafer cleaning after grinding

Wafer size: 150mm&200mm&300mm (customizable)

Process indicators: wafers with processes above 19nm can be cleaned

Automatic Wafer Plating Machine features:

Equipped with 2 or 3 Load ports

Industrial control machine touch screen operation control, convenient and fast

Use genuine industrial iot configuration software for control and monitoring

Support SECS/GEM communication protocol and data transmission

Horizontal chamber, no cross contamination

Equipped with two-arm wafer handling manipulator imported from Japan, efficient and stable

Equipped with up to 8 cleaning chambers (customized)

Cleaning liquid independent control, no cross contamination

Equipped with nozzle liquid flow accurate control system

Our products are very popular, if you are interested in our products, please contact JuYongNeng as soon as possible.